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    AMD revealed more about its 128-GPU MI355X DLC rack and plans for the MI400 making its appearance next year



    • AMD highlighted MI350 series at Hot Chips 2025 with node-to-rack scalability
    • MI355X DLC rack features 128 GPUs 36TB HBM3e and 2.6 exaflops
    • Nvidia’s Vera Rubin system coming next year is a maximum scale beast

    AMD used the recent Hot Chips 2025 event to talk more about the CDNA 4 architecture which powers its new Instinct MI350 series, and show how its accelerators scale from node to rack.

    The MI350 series platforms combine 5th Gen Epyc CPUs, MI350 GPUs, and AMD Pollara NICs in OCP-standard designs with UEC-supported networking. Bandwidth is delivered through Infinity Fabric at up to 1075GB/s.

    At the top end of this is the MI355X DLC ‘Orv3’ rack, a 2OU system with 128 GPUs, 36TB of HBM3e memory, and peak throughput of 2.6 exaflops at FP4 precision (there’s also a 96-GPU EIA version with 27TB of HBM3e).

    MI355X DLC

    (Image credit: AMD)

    Here comes Vera Rubin

    https://cdn.mos.cms.futurecdn.net/PAVevTRqEd7Axb74aWqbpK.jpg



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    waynewilliams@onmail.com (Wayne Williams)

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