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    Future exascale supercomputers will be built using these HPE Lego-like cabinets able to hold nearly 100,000 AMD EPYC Cores




    • HPE’s Cray EX4000 supports modular designs, scaling to 98,304 cores
    • Slingshot 400 interconnect doubles throughput, vital for exascale systems
    • AMD and Nvidia collaborations help compute density exceed 10 petaflops

    Future exascale supercomputers will adopt modular designs that allow enhanced scalability and efficiency, new reports have claimed.

    TheNextPlatform says Hewlett Packard Enterprise (HPE) is leading this transformation, with its Cray EX4000 systems, which use HPE’s Slingshot interconnect and innovative chassis to support up to 98,304 AMD Epyc cores per rack.

    https://cdn.mos.cms.futurecdn.net/DY3HBGjV6UMxzcppSiHCqD-1200-80.jpg



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    waynewilliams@onmail.com (Wayne Williams)

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