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    Cooling high-density data centers with coolant distribution units



    The rise of Generative AI, from tools like ChatGPT to a new wave of AI tools, is reshaping technology demands, driving a surge in the need for advanced CPUs and GPUs. These powerful processors, with ever-increasing thermal design power (TDP)—like Nvidia’s GB200 Grace Blackwell superchip consuming 1,200W per GPU with racks powering 120kW—are pushing power and cooling requirements to unprecedented levels, making traditional air cooling solutions insufficient.

    Enter liquid cooling. With adoption projected to grow at a 45% compound annual growth rate (CAGR) from 2023 to 2028, direct-to-chip liquid cooling solutions, powered by coolant distribution units (CDUs), are transforming how data centers handle the heat generated by high-performance AI workloads. Cooling efficiency isn’t just a consideration—it’s a necessity as AI processors continue to push power and density boundaries.

    https://cdn.mos.cms.futurecdn.net/3a5b921de608f739c438d7e3aaa86a61-1200-80.jpg



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