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    SoftBank and Intel aim to prototype new HBM chip by 2026 with hopes of commercial launch by 2030




    • SoftBank and Intel plan low-power memory to rival South Korean HBM
    • Saimemory aims for 2030 launch but faces major market delays
    • Intel and SoftBank are already stretched across AI chips and tech investments

    SoftBank and Intel are reportedly teaming up to develop a new type of AI-focused high-bandwidth memory that they hope will rival HBM products produced by South Korean tech giants Samsung and SK Hynix.

    A report from Nikkei Asia, claims the pair are aiming to create stacked DRAM chips with a new wiring structure that cuts power consumption by half, compared to current HBM chips.

    https://cdn.mos.cms.futurecdn.net/nF76p6PLXFpbYYokq9D8X7.jpg



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    waynewilliams@onmail.com (Wayne Williams)

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